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Chemical-Mechanical Planarization: Volume 767

Chemical-Mechanical Planarization: Volume 767

Katia Devriendt
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Chemical-mechanical planarization has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation , copper damascene, and novel devices and CMP integration.
Pages
364
Format
Paperback
Publisher
Cambridge University Press
Release
June 05, 2014
ISBN
1107409411
ISBN 13
9781107409415

Chemical-Mechanical Planarization: Volume 767

Katia Devriendt
0/5 ( ratings)
Read Download
Chemical-mechanical planarization has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation , copper damascene, and novel devices and CMP integration.
Pages
364
Format
Paperback
Publisher
Cambridge University Press
Release
June 05, 2014
ISBN
1107409411
ISBN 13
9781107409415

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