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Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages

3.6/5 ( ratings)

*State-of-the-art techniques for predicting and achieving target performance levels *Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether youre modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: *In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues *Multiconductor interconnects: packages, sockets, connectors and buses *Modal decomposition: understanding the outputs generated by commercial modeling software *Layer peeling with time-domain reflectometry: its power and limitations *Experimental techniques for characterizing interconnect parasitics In Dig

Language: English

Pages: 560

Format: Paperback

Publisher: Prentice Hall

Release: October 19, 2000

ISBN: 0130289043

ISBN 13: 9780130289049

Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages

3.6/5 ( ratings)

*State-of-the-art techniques for predicting and achieving target performance levels *Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether youre modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: *In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues *Multiconductor interconnects: packages, sockets, connectors and buses *Modal decomposition: understanding the outputs generated by commercial modeling software *Layer peeling with time-domain reflectometry: its power and limitations *Experimental techniques for characterizing interconnect parasitics In Dig

Language: English

Pages: 560

Format: Paperback

Publisher: Prentice Hall

Release: October 19, 2000

ISBN: 0130289043

ISBN 13: 9780130289049

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